Researchers at King Fahd University of Petroleum and Minerals recently published an application paper on Development of a Ceramic-based Composite for Direct Bonded Copper Substrate. A computational approach is presented to design alumina-based composite with tailored properties that could replace commercial alumina used in Direct Bonded Copper (DBC) substrates for applications in power electronic modules. The primary goal for designing such alumina-based composites is to have enhanced thermal conductivity for effective heat dissipation and spreading capabilities together with a coefficient of thermal expansion (CTE) value that is close to the silicon chips in electronic circuits in order to avoid interface layers. At the same time, other functional properties like elastic modulus and electrical conductivity have to be maintained.
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