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Thermal Conductivity of Printed Circuit Board Dielectric Materials

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Through-plane thermal conductivity data was obtained for three samples with three tests of fifteen measurements each. The mean of the three samples was taken and reported as the through-plane thermal conductivity. In all tests, the relative standard deviation was <1%, and across the three samples, the relative standard error was 0.7%. The in-plane thermal conductivity of the bulk material was measured with three tests of five measurements each. Relative standard deviation was 0.6% across three tests for in-plane thermal conductivity.

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